One low-copper formulation and one copper-free formulation were made into disc pads, and both of them were cured under 4 different conditions. These pads had no backing layer and no scorched layer. Pad thickness, dynamic modulus and natural frequencies were continuously monitored over a period of 12 months. After 12 months at room temperature, pad thickness, dynamic modulus and natural frequencies all increased to higher values. The low-copper formulation increased relatively rapidly during the first 60 days and the copper-free formulation increased relatively rapidly for the first 90 days, and then slowly thereafter. Two competing processes are found to be taking place simultaneously; internal stress relief leading to pad expansion and cross-linking of the resin leading to pad shrinkage. As the pad properties are changing continuously, the timing of property measurement becomes an important issue for quality assurance. Implications of these changing properties are discussed for friction, wear, brake squeal and squeal modeling/simulation, and simple non-destructive test methods are recommended for checking pad quality consistency.
