1994-06-01

Thermal Accommodation of Attached Pressurized Module Payloads 941570

The backbone of the Attached Pressurized Module (APM) is the water cooling loop, which contributes to an optimized payload operation. Dedicated design means are proposed to allow an efficient use of this resource.
In case of a Thermal Control System (TCS) failure a controlled run-down of individual payloads is possible to avoid critical situations like overheating due to heat soak back from a furnace. The TCS is flexible enough to allow short payload power peaks thus optimizing the resource allocation without violation of the thermal requirements regarding the temperature limits.
The APM will be verified against generic thermal and environmental control requirements. The test and analytical verification effort on payload side is dependant whether the payload is a facility integrated in an International Standard Payload Rack (ISPR) or a smaller entity like a drawer as subset of a facility or a self-standing experiment.
No Caption Available
No Caption Available

SAE MOBILUS

Subscribers can view annotate, and download all of SAE's content. Learn More »

Access SAE MOBILUS »

Members save up to 16% off list price.
Login to see discount.
Special Offer: Download multiple Technical Papers each year? TechSelect is a cost-effective subscription option to select and download 12-100 full-text Technical Papers per year. Find more information here.
X