Use of Pb-Free Ball Grid Array Component Soldered Using SnPb Solder ARP6415

DOI: https://doi.org/10.4271/ARP6415

Issuing Committee: G-24 Pb-free Risk Management Committee for ADHP

Publisher: SAE International

Pages: 32

Rationale: Aerospace, defense, and high performance (ADHP) manufacturers have avoided a transition to Pb-free for most products, but the limited availability of ball grid array packages with SnPb alloy solder balls has driven the use of parts with Pb-free solder balls. There have been numerous studies on the use of the Pb-free parts in a SnPb assembly, and this document provides a consolidated summary of the industry best practices and issues related to use of these Pb-free parts.